A substrate integrated power divider/combiner for multidevice millimeter wawe applications
Pietro Ferraris - Università degli Studi di Pavia - [2002-03]
In the last few years a fast growth has been seen in millimeter waves systems applications, leading to an increasing demand for low-cost, small and tuning-free components based on rectangular waveguide. The main problems of conventional waveguide devices are the high manufacturing cost and time, the dimensions of the devices and the diﬃculties in integrating planar and non-planar circuits. In fact in conventional waveguide devices the transitions always consist of two or more separate pieces that require a precision machining process, a careful assembly and, in most cases, a high precision mechanical adjustment or a tuning mechanism. These reasons prevent rectangular waveguide devices from being used in low-cost high-volume applications. A new solution has been proposed by Wu et al. with the introduction of “substrate integrated waveguide” (SIW) or, more generally, “substrate integrated circuits” (SIC).
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